Cutting and grinding methods for cultivating diamonds

The grinding method for cultivating diamonds is basically similar to the grinding method for natural diamonds. Especially, the cutting and grinding of HPHT diamonds is closer to the natural diamond cutting and grinding method.

But there will be polycrystals around CVD diamonds. Before grinding diamonds, it is necessary to completely remove all polycrystals using a laser, and then cut CVD using the same method as cutting natural diamonds. If the polycrystals are not completely eliminated during the initial cutting process, the subsequent cutting and grinding work will be very difficult because each polycrystalline is a crystal.

To cultivate diamond cutting and grinding, it is necessary to use automatic stone grinding machines in any way possible. Firstly, an automatic 3D design instrument is used to draw laser lines on the table and waist circumference. Then, the laser is cut along the position of the laser line to excavate a gyroscope, which is the roughly ground shape. Then, a circle is made and a rough base is made. Or simply make the bottom and then the crown. Try to use automatic equipment for processing to reduce costs

When HPHT white diamonds are polished on each facet by an automatic polishing machine, they generate conductive but colorless contact between the fixture and the grinding disc. But HPHT diamonds themselves have semiconductor properties and cannot be processed using automatic polishing machines. Unless an insulated ceramic sleeve is added, this operation is more difficult.